Capabilities


Tesav’s R&D division, works are carried out by highly educated engineers having master’s and bachelor’s degrees and utilizing high-end design and simulation software. Every single R&D activity planned to meet customer and product requirements.

Our R&D capabilities are as follows:

  • Analog and digital circuit design,
  • PCB design and production,
  • Embedded software and hardware development,
  • Mechanical design and 3D modelling,
  • Mold design and production,
  • EMI/EMC compatibility test,
  • Thermal and tensile strength tests according to the international and military standards.

Industry-Industry and Industry-University cooperation is Tesav’s key to success in large-scale multi-disciplinary R&D projects. Tesav had been carried out many successful R&D projects with its local partners since year of the establishment.